Project SEMICONDUCTOR-X: Resilient supply chains for the semiconductor industry

In May 2024, under the leadership of Intel Germany and the Fraunhofer IFF, more than 20 partners, including the Fraunhofer EMFT, joined forces in the "Semiconductor-X" project. This pioneering research project on digitalization of supply chains in the semiconductor industry has aims to make the complex supply chains in this industry more sustainable and resilient. The coronavirus pandemic has highlighted the weaknesses in supply chains, particularly in Germany and Europe. As part of "Semiconductor-X", the partners are working to make the semiconductor industry more independent, resilient and better protected by promoting decentralized, sovereign data exchange.

Project Semiconductor-X

Intel Germany and Fraunhofer IFF in Magdeburg are the main initiators of the new research project to improve supply chains in the semiconductor industry and chip production. Together with Fraunhofer EMFT and around 20 German companies companies including Elmos, Bosch, Infineon and Siemens, the aim is to jointly develop standards for secure data exchange, Fraunhofer IFF announced. The project has a total volume of 30 million Euros. 

The coronavirus pandemic has shown how dependent Germany and Europe are on computer chips and what consequences even minor disruptions at individual companies can have for the entire supply chain, explained Julia Arlinghaus, Director of the Fraunhofer IFF. This has consequences for customers e.g. when technical devices are not available or become more expensive, and on the other hand for small suppliers who are part of the long supply chain. The aim is to enable data exchange between companies in order to be able to react better to disruptions in supply chains. Artificial intelligence (AI) could be used to create forecasts and thus make supply chains more efficient and sustainable.

Issues such as data security and trade secrets mean that companies are often very reluctant to share data, explained Arlinghaus. The fear of hacker attacks also plays a role. "We are creating standards for the entire industry in the project." The Fraunhofer IFF Magdeburg has already gained experience with a similar project for the automotive industry.

Involvement of the Fraunhofer EMFT 

As part of the Semiconductor-X project, Fraunhofer EMFT employees are contributing to further development with a variety of innovative measures.

Life cycle analysis (LCA) and data structure

First, a data structure for storing the life cycle analysis (LCA) in the Asset Administration Shell (AAS) will be developed, based on environmentally relevant parameters. These LCA processes are carried out by connecting the HQD process system in our institute's clean room.

New sensor nodes and software integration

Another focus is on the development of new sensor nodes that record environmentally relevant parameters in the cleanroom and semiconductor fab context and connect them to the AAS. Fraunhofer EMFT is also integrating all the necessary software modules and the server infrastructure into the AAS.

Methodology and supply chain integration

The methodology for the LCA is being developed along the vertical and horizontal supply chain. To create a database for future analyses using mathematical methods and machine learning, demo runs are carried out on the HQD system.

Optimizations through machine learning

Optimizations with regard to the LCA result and other environmentally relevant parameters are carried out using machine learning (ML) methods. The partners' ML models are processed and implemented in the AAS and on edge devices with limited hardware resources.

Demonstrators and cluster organization

Finally, Fraunhofer EMFT develops and implements demonstrators for the defined subject areas. Together with its industrial partner HQD, it is responsible for the "Sustainability" application cluster and is in charge of the Integration, Validation, Demonstration work package. 

Semiconductor-X is funded by the Federal Ministry of Economics and Climate Protection under the FKZ: 13MX008B.