From Research to Application: Projects at Fraunhofer EMFT

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  • Leading IP Blocks for Europe's Next-Gen FDSOI

    Fraunhofer EMFT brings ultra-low-power analog expertise to the SOIL Project

    Neuromorphic Chips
    © Fraunhofer EMFT/ Bernd Müller

    Neuromorphic Chips

    Within the SOIL project, Fraunhofer EMFT develops FDSOI IP blocks to boost Europe's next-generation chipindustry.

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  • SENNA Connect - a developer kit for spiking neural networks

    Test spiking neural networks on real neuromorphic hardware

    Spiking Neural Networks (SNN)
    © Fraunhofer EMFT / Elisa Göbel

    Spiking Neural Networks (SNN) for a neuromorphic processor

    SENNA Connect develops a developer kit for the SENNA neuromorphic processor, so you can run spiking neural networks on real hardware instead of in simulation.

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  • Chip Foil Package
    © Fraunhofer EMFT

    Example of a chip foil package. The CFP project is developing new processes for the manufacture of ultra-thin, flexible chip packages.

    In the CFP project, Fraunhofer EMFT, Fraunhofer IZM, and Yamagata University are developing novel chip foil packages for flexible electronics. Together, they are working on materials, interconnection technologies, and an end-to-end process chain to reliably integrate electronic functions into soft, curved, or flexible surfaces. The goal is to create chip foil packages less than 150 micrometers thick that can be manufactured efficiently and sustainably in high volumes and used in medicine, industry, mobility, and other fields of application.

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  • © Fraunhofer EMFT

    Shielded flexible superconducting interconnections with more than 80 signal lines per inch

    With the foundation of Munich Quantum Valley (MQV) in 2022, seven leading research institutions in Bavaria, including the Fraunhofer Gesellschaft, have committed themselves to an ambitious goal: Building the first German quantum computer with up to 1000 qubits “made in Bavaria”. The partners are working on realizing full-stack quantum-computer demonstrators, remotely accessible to researchers and industry. Within this framework, Fraunhofer EMFT researchers are contributing their engineering expertise to enable scaling and industrialization of the qubit platform based on superconducting qubits.

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  • © Fraunhofer EMFT/ Bernd Müller

    Silicon wafer with aluminium qubit chips – close-up

    28 European research partners aim at designing, building and operating a quantum processor of up to 1000 qubits in Europe. As part of the project, Fraunhofer EMFT is providing the development of new fabrication processes for qubit chips, which will facilitate chip manufacturing on an industrial scale for commercial use in the future.

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  • Quantum Chips Enter Industrial Manufacturing

    How the SUPREME Pilot Line Is Bridging Research and Scalable Production Made in Europe

    Multi Project superconducting wafer
    © Fraunhofer EMFT / M. Andronic

    Multi-project superconducting qubit structures wafer

    In the EU research project SUPREME, 23 partners from 8 member states are pooling their expertise to advance the development of stable manufacturing processes for superconducting quantum chips. The R&D activities specifically address the challenges related to the stability and yield of qubits – crucial factors for the scaling of quantum technologies and thus for Europe’s competitiveness in the global quantum hardware market.

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  • The research project »Velektronik - Vertrauenswürdige Elektronik (ZEUS)« of the German Federal Ministry for Education and Research (BMBF), aims to establish a networking platform for trusted electronics as an interface between research and industry.

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  • 2-pin test system in the Fraunhofer EMFT test lab for test and analysis of electronic components and systems

    2-pin test system in the Fraunhofer EMFT test lab for test and analysis of electronic components and systems

    The semiconductor industry and manufacturers of electronic components and systems test their products carefully to ensure that they function flawlessly. An important aspect is the tolerance of chips to ESD (electrostatic discharge). Fraunhofer EMFT and High Power Pulse Instruments GmbH (HPPI) have jointly developed a 2-pin test system that offers many advantages to the semiconductor industry.

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  • Control of soldered connection
    © Fraunhofer EMFT/ Bernd Müller

    Control of soldered connection

    Microrelative movements can lead to crack formation and crack growth in press-fit connections. Together with the Institute of Materials Engineering and the Institute of Drive and Vehicle Technology, both at the University of Kassel, Fraunhofer EMFT researchers are working on a suitable accelerating model to better understand how these undesirable effects occur.

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