From Research to Application: Projects at Fraunhofer EMFT

Microrelative movements can lead to crack formation and crack growth in press-fit connections. Together with the Institute of Materials Engineering and the Institute of Drive and Vehicle Technology, both at the University of Kassel, Fraunhofer EMFT researchers are working on a suitable accelerating model to better understand how these undesirable effects occur.

Press-fit technology provides an innovative connection method which, due to its high reliability and robustness, is particularly suitable for safety-relevant connection points. Another advantage is that the method is much more eco-friendly than the soldering technique most commonly used to date. A Fraunhofer EMFT research team is working on a predictive model that relates easily accessible material/process data to the reliability of press-fit contacts.

With the Soldering Mobile, the Center for Interconnection Technology in Electronics ZVE at Fraunhofer EMFT is now offering its customers an attractive alternative to onsite training courses at the Oberpfaffenhofen training center. The soldering station on wheels can be put into operation directly at the customer's premises using plug & play.

Whether in automobiles – especially in the context of autonomous driving – or future industrial manufacturing: plugs and electrical connection technologies have a key role to play in digital networking. They are the main interface between machines, control units and data processing systems and so they provide the basis for the functionality, simple handling and reliability of automation technology.

In the PCB direct contacting research project (T-1753), Fraunhofer EMFT investigated PCB direct contacting systems for highly reliable mechatronic and drive technology applications. The aim was to evaluate commercially available systems in terms of technical performance, reliability and economic suitability under realistic environmental and stress conditions.

The research project »Velektronik - Vertrauenswürdige Elektronik (ZEUS)« of the German Federal Ministry for Education and Research (BMBF), aims to establish a networking platform for trusted electronics as an interface between research and industry.

The semiconductor industry and manufacturers of electronic components and systems test their products carefully to ensure that they function flawlessly. An important aspect is the tolerance of chips to ESD (electrostatic discharge). Fraunhofer EMFT and High Power Pulse Instruments GmbH (HPPI) have jointly developed a 2-pin test system that offers many advantages to the semiconductor industry.

In the European project SpikeHERO, Fraunhofer EMFT develops input neurons that turn photocurrents into spikes, plus a SENNA redesign targeting spike rates up to 500 MHz.

In areas where personal or security-critical data is processed in particular – such as medical technology, autonomous driving and critical infrastructures – trustworthy electronic ICT components and systems are becoming increasingly important as digitalization gathers pace. Researchers at Fraunhofer EMFT primarily focus on the hardware level here.

Cynergy4MIE is an EU-funded research project aimed at developing a platform for sensor technology, electronics and AI in mobility, infrastructure and energy systems. The goal is to accelerate innovation and strengthen Europe's competitiveness.

How can supply chains for the chip industry become more independent and better protected? The coronavirus pandemic in particular has highlighted the problems for Germany and Europe. In the "Semiconductor-X" research project on the digitalization of supply chains in the semiconductor industry, Fraunhofer EMFT is working with over 20 partners to make supply chains more sustainable and resilient and to promote decentralized, sovereign data exchange.

The technology is already state of the art in modern cars: radar sensors that alert the driver when the vehicle is approaching an obstacle. Collision protection of this kind is also crucial in the future of production - smart factories in which intelligent industrial robots are expected to act completely autonomously in an increasing number of work steps - in order to ensure safe cooperation between man and machine. In the RoboMove project, Fraunhofer EMFT is working with robotics manufacturer KUKA and InnoSenT GmbH to develop an intelligent 3D distance measurement and obstacle detection system for robot arms in motion.

The DigiSeal research project is setting new standards in the predictive maintenance of mechanical seals, which are essential for many branches of industry. By using informed AI and the expertise of Fraunhofer EMFT, precise models are being developed that not only predict maintenance requirements, but also provide specific recommendations for action. Together with partners such as EagleBurgmann Germany GmbH & Co. KG, Molkerei Alois Müller GmbH & Co. KG and Munich University of Applied Sciences, digitalization in the industry is being driven forward and a significant contribution is being made to Industry 4.0.

Gear oils make a significant contribution to minimising friction and thus ensure the safe operation of production facilities. In the Smart Gear project, researchers at Fraunhofer EMFT are developing solutions to detect a drop in the performance of gear oils with the help of sensor technology and machine learning methods and to predict when the oil needs to be changed.

The aim of predictive maintenance is to maintain operating resources proactively and with foresight. This should reduce downtime and maintenance costs to a minimum. Researchers at Fraunhofer EMFT are testing new concepts that use machine learning methods to efficiently process even extremely heterogeneous data and make accurate maintenance predictions for production facilities.

Safety First! - Is the motto of the "StressScent III" project, in which researchers from Fraunhofer EMFT, in collaboration with the University of the Bundeswehr Munich, have developed a Virtual Reality System (VR System) which uses realistic and immersive training to better prepare rescue and emergency personnel for sometimes dangerous missions and stressful situations and thus contribute to a safer working life. Through realistic training engaging all senses, real-world situations can be simulated more accurately, thus contributing to a safer work life. The goal of the project is to develop a scent dosing system adapted to an existing VR headset for practical application.

Within the SOIL project, Fraunhofer EMFT develops FDSOI IP blocks to boost Europe's next-generation chipindustry.

SENNA Connect develops a developer kit for the SENNA neuromorphic processor, so you can run spiking neural networks on real hardware instead of in simulation.

In the CFP project, Fraunhofer EMFT, Fraunhofer IZM, and Yamagata University are developing novel chip foil packages for flexible electronics. Together, they are working on materials, interconnection technologies, and an end-to-end process chain to reliably integrate electronic functions into soft, curved, or flexible surfaces. The goal is to create chip foil packages less than 150 micrometers thick that can be manufactured efficiently and sustainably in high volumes and used in medicine, industry, mobility, and other fields of application.

With the foundation of Munich Quantum Valley (MQV) in 2022, seven leading research institutions in Bavaria, including the Fraunhofer Gesellschaft, have committed themselves to an ambitious goal: Building the first German quantum computer with up to 1000 qubits “made in Bavaria”. The partners are working on realizing full-stack quantum-computer demonstrators, remotely accessible to researchers and industry. Within this framework, Fraunhofer EMFT researchers are contributing their engineering expertise to enable scaling and industrialization of the qubit platform based on superconducting qubits.