HyPerStripes: Hybrid integrated high Performance Electronic Stripes

Even in today's innovative, miniaturized electronic products, traditional wiring is still prevalent. The challenge with manual wiring is that it affects reliability, production yield, weight and resource consumption, accounting for up to  80% of product costs. Additionally, it limits  further miniaturization possibilities. In the HyPerStripes project, researchers at Fraunhofer EMFT are working with 16 partners from three European countries on a promising alternative: Generation of long, flexible and stretchable electronic film stripes (“hyperstripes”) using digital roll-to-roll (R2R) lithography to replace conventional cables and printed circuit boards.

The project's goal is to develop technologies and production techniques for long stretchable and flexible electronic systems of longer than one meter to replace traditional cables. To achieve this, the project partners are creating a technology platform that encompasses manufacturing techniques for R2R processing and the integration of electronic components on very long, flexible, and stretchable printed circuit boards focusing on two key applications in medical instruments used in minimally invasive procedures, such as catheters and implants, and in environmentally friendly LED lighting surfaces. For example, large, flat light surfaces could be developed, to be fully integrated into the glazing of buildings and ultimately imitating natural light.

The key task of Fraunhofer EMFT is the development of R2R lithography processes using digital direct writing processes, with the particular challenge of realizing continuous and very closely spaced conductor paths over a length of 1 to 3m. For this purpose, a so-called “stitching” process is being developed, to be demonstrated on both polyimide films and stretchable TPU (thermoplastic polyurethane) foils.

These developments are designed to pave the way for more efficient products and new applications while reducing the costs and environmental impact of production. The project partners are aiming to transfer the know-how they have gained to industrial production as quickly and smoothly as possible: This is done via an open, sustainable technology platform, that offers printing technologies, lithographically structured copper wiring systems and low-temperature assembly steps - all in a consulting and manufacturing platform from a single source.

The project is funded by the Federal Ministry of Education and Research under the reference 16ME0467K.